[IEEE 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (27 Nov.-1 Dec. 1995)] Proceedings of 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Silicate contamination on ceramic IC packages and its effect on lid adhesion properties
Chin, B., Lim, K., Chong, Y.C.Year:
1995
Language:
english
DOI:
10.1109/ipfa.1995.487627
File:
PDF, 388 KB
english, 1995