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[IEEE 1995 Japan International Electronic Manufacturing Technology Symposium - Omiya, Japan (4-6 Dec. 1995)] Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium - Development of very thin (0.5 mmt) transfer-molded TAB packages
Seung-Ho Ahn,, Maeda, Y.Year:
1996
Language:
english
DOI:
10.1109/iemt.1995.540998
File:
PDF, 866 KB
english, 1996