[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - C4NP - Lead Free Flip Chip Solder Bumping Manufacturing and Reliability Data
Laine, Eric, Ruhmer, Klaus, Belanger, Luc, Turgeon, Michel, Perfecto, Eric, Longworth, Hai, Hawken, DavidYear:
2006
Language:
english
DOI:
10.1109/icept.2006.359758
File:
PDF, 7.57 MB
english, 2006