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[IEEE 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (21-25 July 1997)] Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Thermomechanical and electromigration studies with a high sensitive and high resolution laser probe
Dilhaire, S., Phan, T., Schaub, E., Claeys, W.Year:
1997
Language:
english
DOI:
10.1109/ipfa.1997.638122
File:
PDF, 693 KB
english, 1997