Wafer-Level Packaging of Micromechanical Resonators

IEEE Transactions on Advanced Packaging 2007 / 02 Vol. 30; Iss. 1

Wafer-Level Packaging of Micromechanical Resonators

Joseph, Paul Jayachandran, Monajemi, Pejman, Ayazi, Farrokh, Kohl, Paul A.
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Volume:
30
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2006.890220
Date:
February, 2007
File:
PDF, 3.18 MB
english, 2007
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