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[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Study on the fatigue life of the FC-BGA solder joints with Damage
Yubing, Gong, QuanYong, Li, Daoguo, YangYear:
2006
Language:
english
DOI:
10.1109/hdp.2005.251381
File:
PDF, 272 KB
english, 2006