[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Effect of Al addition in Sn-Ag solder on the interfacial reactions with Cu and ENIG metallizations
Young-Kun Jee,, Yang-hua Xia,, Jin Yu,, Hyun-Woo Kang,, Taek-Young Lee,Year:
2008
Language:
english
DOI:
10.1109/ectc.2008.4550017
File:
PDF, 2.29 MB
english, 2008