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[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Stress evolution in an encapsulated MEMS package due to viscoelasticity of packaging materials
Park, Seungbae, Liu, Dapeng, Kim, Yeonsung, Lee, Hohyung, Zhang, SamYear:
2012
Language:
english
DOI:
10.1109/ectc.2012.6248808
File:
PDF, 1.26 MB
english, 2012