[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Evaluation of fine-pitch chip-to-chip interconnects using ACF material with arrayed particles
Yu-Wei Huang,, Su-Tsai Lu,, Jon-Shiou Peng,, Chia-Wen Fan,, Su-Ching Chung,, Su-Mei Chen,, Yu-Lan Lu,, Pai-Cheng Chang,, Chau-Jie Zhan,Year:
2012
Language:
english
DOI:
10.1109/impact.2012.6420274
File:
PDF, 1.64 MB
english, 2012