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[IEEE 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Taipei, Taiwan (2012.12.9-2012.12.11)] 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Chip-package-PCB co-design: Dealing with harmonic desensitization in RF SoC/SiP
Han, Fu-Yi, Wu, Wen Zhou, Lee, Herbert, Hsieh, Tony, Tang, Tina, Chen, Nan-ChengYear:
2012
Language:
english
DOI:
10.1109/edaps.2012.6469441
File:
PDF, 1.21 MB
english, 2012