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[IEEE 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Austin, TX, USA (2010.10.25-2010.10.27)] 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems - Analysis of power distribution network in TSV-based 3D-IC
Kim, Kiyeong, Lee, Woojin, Kim, Jaemin, Song, Taigon, Kim, Joohee, Pak, Jun So, Kim, Joungho, Lee, Hyungdong, Kwon, Yongkee, Park, KunwooYear:
2010
Language:
english
DOI:
10.1109/epeps.2010.5642575
File:
PDF, 621 KB
english, 2010