[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Low temperature wafer bonding for wafer-level 3D integration
Dragoi, V., Rebhan, B., Burggraf, J., Razek, N.Year:
2014
Language:
english
DOI:
10.1109/ltb-3d.2014.6886148
File:
PDF, 846 KB
english, 2014