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[IEEE 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium - Petaling Jaya, Malaysia (2007.11.8-2007.11.10)] 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium - Advantages & Challenges of Cold Ball Pull Test vs Conventional Ball Shear Test in the Assessment of Lead-free Solder Joint Performance
Leng, Eu Poh, Ding, Min, Jiun, Hoh Huey, Ahmad, Ibrahim, Hazlinda, KamarudinYear:
2006
Language:
english
DOI:
10.1109/iemt.2006.4456508
File:
PDF, 3.81 MB
english, 2006