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[IEEE IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (7-11 July 2003)] Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003 - A novel integrated scheme to improve the electrical and electromigration performance of Cu interconnects
Yeow Kheng Lim,, Suat Cheng Khoo,, Kai Tern Sih,, Chim Seng Seet,, Bei Chao Zhang,, Tae Jong Lee,Year:
2003
Language:
english
DOI:
10.1109/ipfa.2003.1222751
File:
PDF, 329 KB
english, 2003