Using Transmission Laser Bonding Technique for Line Bonding...

Using Transmission Laser Bonding Technique for Line Bonding in Microsystem Packaging

Tseng, Ampere A., Park, Jong-Seung
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Volume:
29
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2006.887356
Date:
October, 2006
File:
PDF, 1.68 MB
english, 2006
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