![](/img/cover-not-exists.png)
Using Transmission Laser Bonding Technique for Line Bonding in Microsystem Packaging
Tseng, Ampere A., Park, Jong-SeungVolume:
29
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2006.887356
Date:
October, 2006
File:
PDF, 1.68 MB
english, 2006