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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Design and fabrication of a TSV interposer for SRAM integration
Zhu, Yunhui, Ma, Shenglin, Cui, Qinghu, Kang, Wenping, Zhu, Zhiyuan, Sun, Xin, Wang, Guanjiang, Zhang, Mengmeng, Chen, Jing, Miao, Min, Jin, YufengYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066784
File:
PDF, 2.60 MB
english, 2011