Effect of geometry and temperature cycle on the reliability...

IEEE Transactions on Components and Packaging Technologies 2005 / 09 Vol. 28; Iss. 3

Effect of geometry and temperature cycle on the reliability of WLCSP solder joints

Chaparala, S.C., Roggeman, B.D., Pitarresi, J.M., Sammakia, B.G., Jackson, J., Griffin, G., McHugh, T.
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2005.853589
Date:
September, 2005
File:
PDF, 855 KB
english, 2005
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