[IEEE 2006 European Microwave Integrated Circuits Conference - Manchester, UK (2006.09.10-2006.09.13)] 2006 European Microwave Integrated Circuits Conference - Advanced 3D Packaging using Novel Liquid Crystalline Polymer Based Substrates
Ghiu, Camil-daniel, Dalmia, Sidharth, Vickers, Jack, Carastro, Larry, Czakon, Winston, Sundaram, Venky, White, GeorgeYear:
2006
Language:
english
DOI:
10.1109/emicc.2006.282704
File:
PDF, 2.82 MB
english, 2006