Integrity of Micro-Hotplates During High-Temperature...

Journal of Microelectromechanical Systems 2010 / 10 Vol. 19; Iss. 5

Integrity of Micro-Hotplates During High-Temperature Operation Monitored by Digital Holographic Microscopy

Lai, Y. W., Koukourakis, N., Gerhardt, N. C., Hofmann, M. R., Meyer, R., Hamann, S., Ehmann, M., Hackl, K., Darakis, E., Ludwig, A.
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Volume:
19
Language:
english
Journal:
Journal of Microelectromechanical Systems
DOI:
10.1109/jmems.2010.2067442
Date:
October, 2010
File:
PDF, 606 KB
english, 2010
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