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[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - A Compliant and Creep Resistant SAC-Al(Ni) Alloy
Huang, Benlih, Hwang, Hong-Sik, Lee, Ning-ChengYear:
2007
Language:
english
DOI:
10.1109/eptc.2007.4469840
File:
PDF, 5.38 MB
english, 2007