An investigation on thermal reliability of underfilled PBGA...

IEEE Transactions on Electronics Packaging Manufacturing 2002 / 10 Vol. 25; Iss. 4

An investigation on thermal reliability of underfilled PBGA solder joints

Zhang Liji,, Wang Li,, Xie Xiaoming,, Kempe, W.
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Volume:
25
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2002.807720
Date:
October, 2002
File:
PDF, 1.03 MB
english, 2002
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