Recrystallization and ${\rm Ag}_{3}{\rm Sn}$ Particle...

IEEE Transactions on Components Packaging and Manufacturing Technology 2013 / 11 Vol. 3; Iss. 11

Recrystallization and ${\rm Ag}_{3}{\rm Sn}$ Particle Redistribution During Thermomechanical Treatment of Bulk Sn–Ag–Cu Solder Alloys

Sahaym, Uttara, Talebanpour, Babak, Seekins, Sean, Dutta, Indranath, Kumar, Praveen, Borgesen, Peter
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Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2013.2272543
Date:
November, 2013
File:
PDF, 4.56 MB
english, 2013
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