[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Nanoscale analysis of ultrasonic wedge bond interface by using high-resolution transmission electron microscopy
Hongjun Ji,, Mingyu Li,, Chunqing Wang,, Jongmyung Kim,, Daewon Kim,Year:
2008
Language:
english
DOI:
10.1109/icept.2008.4607055
File:
PDF, 393 KB
english, 2008