[IEEE 2008 Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, Korea (South) (2008.12.10-2008.12.12)] 2008 Electrical Design of Advanced Packaging and Systems Symposium - Enhanced wire bond transition from die to chip carrier for 3.1-10.6 GHz UWB applications
Fourquin, Olivier, Cubillo, Joseph Romen, Gaubert, Jean, Bourdel, Sylvain, Battista, MarcYear:
2008
Language:
english
DOI:
10.1109/edaps.2008.4736039
File:
PDF, 691 KB
english, 2008