![](/img/cover-not-exists.png)
[IEEE 2000 22nd International Conference on Microelectronics. Proceedings - Nis, Yugoslavia (14-17 May 2000)] 2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400) - Fabrication of high quality SOI bonding materials by modified direct wafer bonding technique
Grekhov, I.V., Kostina, L.S., Argunova, T.S., Beliakova, E.I., Kudriavtseva, T.V., Gutkin, M.Yu., Kim, E.D., Kim, S.C.Volume:
2
Year:
1999
Language:
english
DOI:
10.1109/icmel.2000.838738
File:
PDF, 314 KB
english, 1999