[IEEE 2013 IEEE 22nd Conference on Electrical Performance...

  • Main
  • [IEEE 2013 IEEE 22nd Conference on...

[IEEE 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2013.10.27-2013.10.30)] 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems - Implementation of a RF front-end module by embedding ICs in molding package

Ryu, Jong-In, Park, Se Hoon, Yook, Jong Min, Kim, Dongsu, Park, Jong Chul
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2013
Language:
english
DOI:
10.1109/epeps.2013.6703494
File:
PDF, 840 KB
english, 2013
Conversion to is in progress
Conversion to is failed