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[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Characterization of a novel fluxless surface preparation process for die interconnect bonding
Schulte, Eric F., Cooper, Keith A., Phillips, Matthew, Shinde, Subhash L.Year:
2012
Language:
english
DOI:
10.1109/ectc.2012.6248801
File:
PDF, 1.08 MB
english, 2012