![](/img/cover-not-exists.png)
Parametric compact models for flip chip assemblies
Van Dooren, S., Vandevelde, B., Beyne, E., Christiaens, F., Corlatan, D.Volume:
23
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.868858
Date:
January, 2000
File:
PDF, 323 KB
english, 2000