IEEE Transactions on Components Packaging and Manufacturing Technology Part A
1997 / 6 Vol. 20; Iss. 2
Ferroelectric nonvolatile memory technology: applications and integration challenges
Zurcher, P., Jones, R.E., Chu, P.Y., Taylor, D.J., White, B.E., Zafar, S., Bo Jiang,, Yeong-Jyh Tom Lii,, Gillespie, S.J.Volume:
20
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.588571
Date:
June, 1997
File:
PDF, 174 KB
english, 1997