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[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - The Improvement of Sweep Stiffness and Thermomechanical Properties of Wire Bonds for Pure Gold Wire with Dopant
Kung, Huang-Kuang, Chen, Hung-Shyong, Lee, Jeng-Nan, Sun, Yun-PingYear:
2007
Language:
english
DOI:
10.1109/eptc.2007.4469703
File:
PDF, 248 KB
english, 2007