[IEEE 2008 Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, Korea (South) (2008.12.10-2008.12.12)] 2008 Electrical Design of Advanced Packaging and Systems Symposium - A circuit model for ESD performance analysis of printed circuit boards
Seol, Byong-Su, Lee, Jong-Sung, Lim, Jae-Deok, Lee, Hyungseok, Park, HarkByeong, Nandy, Argha, Pommerenke, DavidYear:
2008
Language:
english
DOI:
10.1109/edaps.2008.4736014
File:
PDF, 779 KB
english, 2008