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[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - A Wafer-Level 3D Integration Using Bottom-Up Copper Electroplating and Hybrid Metal-Adhesive Bonding
Song, Chongshen, Wang, Zheyao, Tan, Zhimin, Liu, LitianYear:
2009
Language:
english
DOI:
10.1109/iitc.2009.5090374
File:
PDF, 468 KB
english, 2009