[IEEE 2009 IEEE International Interconnect Technology...

  • Main
  • [IEEE 2009 IEEE International...

[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - A Wafer-Level 3D Integration Using Bottom-Up Copper Electroplating and Hybrid Metal-Adhesive Bonding

Song, Chongshen, Wang, Zheyao, Tan, Zhimin, Liu, Litian
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2009
Language:
english
DOI:
10.1109/iitc.2009.5090374
File:
PDF, 468 KB
english, 2009
Conversion to is in progress
Conversion to is failed