[IEEE 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Jose, CA, USA (2013.10.27-2013.10.30)] 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems - Design and verification of SMT MMIC package using a 20 GHz LNA, a 40 GHz LNA and a 40GHz digital attenuator

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