[IEEE 2012 IEEE/MTT-S International Microwave Symposium - MTT 2012 - Montreal, QC, Canada (2012.06.17-2012.06.22)] 2012 IEEE/MTT-S International Microwave Symposium Digest - Wafer-level BCB CAP packaging of integrated MEMS switches with MMIC
Seok, Seonho, Kim, Janggil, Fryziel, Michel, Rolland, Nathalie, Rolland, Paul-alain, Maher, H., Simon, W., Baggen, R.Year:
2012
Language:
english
DOI:
10.1109/mwsym.2012.6258270
File:
PDF, 692 KB
english, 2012