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[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Integration of carrierless ultrathin wafers into a TSV process flow
Bieck, Florian, Spiller, Sven, Molina, Froilan, Topper, Michael, Lopper, Christina, Kuna, Ingrid, Fischer, Thorsten, Roder, Julia, Dietrich, Lothar, Tabuchi, TomotakaYear:
2010
Language:
english
DOI:
10.1109/eptc.2010.5702703
File:
PDF, 2.03 MB
english, 2010