[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Cu Pillar and μ-bump electromigration reliability and comparison with high pb, SnPb, and SnAg bumps
Syed, Ahmer, Dhandapani, Karthikeyan, Moody, Robert, Nicholls, Lou, Kelly, MikeYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898534
File:
PDF, 878 KB
english, 2011