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Experimental and Simulation Study of Double-Sided Flip-Chip Assembly With a Stiffener Ring
Liu, Xi, Li, Ming, Mullen, Donald R., Cline, Julia, Sitaraman, Suresh K.Volume:
14
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2013.2283062
Date:
March, 2014
File:
PDF, 2.74 MB
english, 2014