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[IEEE Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium 1997 IEMT Symposium - Austin, TX, USA (13-15 Oct. 1997)] Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium - Assembly and reliability of thermally enhanced high I/O BGA packages
Ejim, T.I., Hollesen, D.B., Holliday, A., Gahr, S.A., Coyle, R.J.Year:
1997
Language:
english
DOI:
10.1109/iemt.1997.626868
File:
PDF, 841 KB
english, 1997