[IEEE 2009 10th International Conferene on Thermal,...

[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Cohesive zone simulation on dynamic fracture at the interfaces of a single solder joint

Feng Gao,, Jianping Jing,, Liang, Frank Z., Williams, Richard L., Jianmin Qu,

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Year:

2009

Language:

english

DOI:

10.1109/esime.2009.4938512

File:

PDF, 15.42 MB

english, 2009

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