[IEEE IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems - Kyoto, Japan (19-23 Jan. 2003)] The Sixteenth Annual International Conference on Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE - A novel thin chip scale packaging of the RF-MEMS devices using ultra thin silicon
Yun-Kwon Park,, Yong-kook Kim,, Hoon Kim,, Duck-Jung Lee,, Chul-Ju Kim,, Byeong-Kwon Ju,, Jong-Oh Park,Year:
2003
Language:
english
DOI:
10.1109/memsys.2003.1189825
File:
PDF, 282 KB
english, 2003