Analysis of Al Doping Effects on Resistivity and...

IEEE Transactions on Device and Materials Reliability 2008 / 03 Vol. 8; Iss. 1

Analysis of Al Doping Effects on Resistivity and Electromigration of Copper Interconnects

Yokogawa, S., Tsuchiya, H., Kakuhara, Y., Kikuta, K.
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Volume:
8
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2007.915003
Date:
March, 2008
File:
PDF, 429 KB
english, 2008
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