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[IEEE Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 - Taiwan (5-8 July 2004)] Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743) - Discoloration related failure mechanism and its root cause in electroless nickel immersion gold (ENIG) pad metallurgical surface finish
Chong Kam Meng,, Selvamuniandy, T.S., Gurumurthy, C.Year:
2004
Language:
english
DOI:
10.1109/ipfa.2004.1345605
File:
PDF, 331 KB
english, 2004