[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks
Brunschwiler, T., Paredes, S., Drechsler, U., Michel, B., Wunderle, B., Reichl, H.Year:
2012
Language:
english
DOI:
10.1109/itherm.2012.6231481
File:
PDF, 6.16 MB
english, 2012