[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - High temperature lead-free solder joints via mixed powder system
Zhang, HongWen, Lee, Ning-ChengYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066814
File:
PDF, 5.83 MB
english, 2011