[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China...

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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - High temperature lead-free solder joints via mixed powder system

Zhang, HongWen, Lee, Ning-Cheng
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Year:
2011
Language:
english
DOI:
10.1109/icept.2011.6066814
File:
PDF, 5.83 MB
english, 2011
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