[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Trends and challenges in lead free soldering
Lopes, Dias, Pinto, Margarida, Assuncao, Eurico, Coutinho, LuisaYear:
2012
Language:
english
DOI:
10.1109/esime.2012.6191697
File:
PDF, 968 KB
english, 2012