[IEEE 2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - Nara, Japan (2013.12.15-2013.12.18)] 2013 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo) - Modeling and analysis of open defect in through silicon via (TSV) channel
Jung, Daniel H., Heegon Kim,, Kim, Jonghoon J., Joungho Kim,, Hyun-Cheol Bae,, Kwang-Seong Choi,Year:
2013
Language:
english
DOI:
10.1109/emccompo.2013.6735193
File:
PDF, 557 KB
english, 2013