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Conductive filament formation: a potential reliability issue in laminated printed circuit cards with hollow fibers
Pecht, M., Hillman, C., Rogers, K., Jennings, D.Volume:
22
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/6104.755092
Date:
January, 1999
File:
PDF, 233 KB
english, 1999