[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Next generation electroplating technology for high planarity, minimum surface deposition microvia filling
Ming-Yao Yen,, Ming-Hung Chiang,, Hsu-Hsin Tai,, Hsien-Chang Chen,, Kwok-Wai Yee,, Li, Crystal, Lefebvre, Mark, Bayes, MartinYear:
2012
Language:
english
DOI:
10.1109/impact.2012.6420290
File:
PDF, 1.14 MB
english, 2012