![](/img/cover-not-exists.png)
Enhancement of thermal conductivity with Cu for nanofluids using chemical reduction method
Min-Sheng Liu, Mark Ching-Cheng Lin, C.Y. Tsai, Chi-Chuan WangVolume:
49
Year:
2006
Language:
english
Pages:
6
DOI:
10.1016/j.ijheatmasstransfer.2006.02.012
File:
PDF, 234 KB
english, 2006