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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Study of interconnection process for fine pitch flip chip
Minjae Lee,, Min Yoo,, Jihee Cho,, Seungki Lee,, Jaedong Kim,, Choonheung Lee,, Daebyoung Kang,, Zwenger, Curtis, Lanzone, RobertYear:
2009
Language:
english
DOI:
10.1109/ectc.2009.5074092
File:
PDF, 1.09 MB
english, 2009